In 2002, the single crystal silicon production line，jointly ventured by Shenhe Thermal-Magnetics, together with Toshiba Ceramics 

Japan, Mitsui & Co., Ltd., and Ferrotec (China), was established with the introduction of production technology of single crystal 

wafer；

In 2003, the wafer was officially put into production;

At the end of 2004, the project reached its target capacity;

In February 2015, Shanghai Shenhe Thermal Magnetics' “high-performance n-type semiconductor silicon chip” project listed 

in the technology absorption and innovation plan of Shanghai; 

In May 2016, Shanghai Shenhe Thermal Magnetics’ Semiconductor 8-inches wafer polishing line project started its construction;

In July 2017, Shanghai Shenhe Thermal Magnetics Electronics Co., Ltd completed its big wafer project and put it into production.

 At the same time, Ferrotec Ningxia Semiconductor Technology Co., Ltd. which was invested by Shenhe Thermal Magnetics 

finished its construction as well. Two of these projects constitute a first-phase program of 8” single crystal wafer with annual 

capacity of 1.8 million pieces;

In December 2017, ShenheThermal Magnetics invested 6 billion yuan to launch 8” wafer project and 12” wafer project with 

annual capacity of 3.6 million pieces and 2.4 million pieces respectively, which gradually realizes mass production for 8” and 

12” wafer;

In March 2018, Ferrotec Ningxia Semiconductor Technology Co., Ltd., which is supporting large-size semiconductor wafer projects, 

invested 1.6 billion yuan in the Yinchuan economic and technological development district to build an internationally advanced 8" 

and 12" semiconductor wafer production base.